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Title: IMPROVING MANUFACTURING RELIABILITY IN IC PACKAGE ASSEMBLY USING THE FMEA TECHNIQUE
Author: PRASAD, S
Abstract: Potential failure mode and effect analysis FMEA technique has been successfully used in both aerospace and automobile industries for enhancing the assembly manufacturing reliability of the product. Only recently, is the FMEA technique being used in the IC assembly manufacturing. The unprecedented package related failure of a microchip in a computer, space or in an automobile could have dire consequences. The FMEA technique was developed to give the engineer clear control over such failures before they reach the unwary customer. The packaging of an IC chip either as a single component or as a multichip module involves: designing a package, selecting appropriate materials, choosing the assembly processes, and selecting the proper equipment. The final product cost, reliability, and customer satisfaction is highly dependent on the compatibility between and quality level achieved in each of the above mentioned variables. This paper presents the basic FMEA technique as applied to IC assembly and shows how the technique is useful for complex package assembly and multichip module assembly. The use of FMEA for improving the manufacturability and manufacturing reliability of packages by a systematic and quantified analysis of the package design and process is also discussed.
Source: IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY
Publication Year: 1991
Volume: 14
Issue nr: 3
Pages: 452 - 456
Science Code: Engineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary
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