IMPROVING MANUFACTURING RELIABILITY IN IC PACKAGE ASSEMBLY USING FMEA TECHNIQUE

Author: PRASAD, S
Abstract:
Source: NINTH IEEE/CHMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM : COMPETITIVE MANUFACTURING FOR THE NEXT DECADE - PROCEEDINGS : 1990 IEMT SYMPOSIUM
Publication Year: 1990
Volume:
Issue nr:
Pages: 356 - 360
Science Code: Engineering, Electrical & Electronic; Operations Research & Management Science
Tags:

1978- 1993	fmea_abstract_abstracts_1.htm
- 1997	fmea_abstract_abstracts_2.htm
- 1999	fmea_abstract_abstracts_3.htm
- 2000	fmea_abstract_abstracts_4.htm
- 2002	fmea_abstract_abstracts_5.htm
- 2004	fmea_abstract_abstracts_6.htm
- 2004 cnd	fmea_abstract_abstracts_7.htm
- 2005	fmea_abstract_abstracts_8.htm
- 2006	fmea_abstract_abstracts_9.htm
- 2007	fmea_abstract_abstracts_10.htm
- 2008	fmea_abstract_abstracts_11.htm
- 2008 cnd	fmea_abstract_abstracts_12.htm
- 2009	fmea_abstract_abstracts_13.htm
- 2009 cnd	fmea_abstract_abstracts_14.htm

FMEA Info Centre

Everything you want to know about Failure Mode and Effect Analysis

FMEA Info Centre

All you want to know about Failure Mode and Effect Analysis